Super AG-1 |
ForceTake “Super AG-1” features the high thermal conductivity and low thermal resistance, bleeding enough for smearing, and it can be kept in durable and stable status when using over time. “Super AG-1” is the most excellent thermal interface material for CPU / VGA / Chipset cooling application and so on. |
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Introduction |
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ForceTake “Super AG-1” features the high thermal conductivity and low thermal resistance, bleeding enough for smearing, and it can be kept in durable and stable status when using over time. “Super AG-1” is the most excellent thermal interface material for CPU / VGA / Chipset cooling application and so on. |
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Specification |
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● High Thermal Conductivity
● Low Thermal Resistance
● Low Electrical Conductivity
● Easy to Smear
● Rohs Compliance
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Specification |
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Net Weight : 4g |
Property / Color : Gray Paste |
Thermal Conductivity : 4.1 w/mk |
Thermal Resistance : 8 (30μm) mm2-K/W |
Viscosity : 300 Pa.s |
Bleed (150 degree x 24 hrs) : < 0.1% |
Evaporation (150 degree x 24hrs) : 0.3% |
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Performance Test |
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